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Thin Electroplate Diamond Blade

APPLICATION SCOPE: Electroplated diamond saw blades have a wide range of applications. They can be used to cut hard brittle materials such as glass tubes, gemstones, jade, crystals, and optical glass. They can also be used for cutting and grinding high-hardness materials such as hard alloys,...

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APPLICATION SCOPE:
Electroplated diamond saw blades have a wide range of applications. They can be used to cut hard brittle materials such as glass tubes, gemstones, jade, crystals, and optical glass. They can also be used for cutting and grinding high-hardness materials such as hard alloys, ceramics, and gem magnetic materials.

DSC04021 副本.jpg

PRODUCT ADVANTAGES:
Electroplated diamond saw blades are electroplated and diamonds are plated on a substrate. The grain size is generally 120#.
The electroplated diamond saw blade has the characteristics of thin disk surface, sharp cutting edge, no cutting edge, smooth cutting, high speed, high efficiency and less waste.

SIZE:

DiameterApertureThickness
Inchmmmmmm
4"100201
6"15020/250.5
8"200250.7
10"250250.7
10"250251
12"300321
12"300321.2
12"30025/321.5
14"35025/321
14"350321.2
14"350321.5
16"40025/321
16"400321.2
16"40025/321.5
18"45025/321.2
18"45025/321.5
20"500321.2
20"50025/321.5
20"500322
22"55025/321.5
22"55025/322
24"60025/321.5
24"60025/322
30"760362
32"810362
34"860362
36"910362
40"100036/322.5
48"122036/322.5
50"1250362.5
60"150025/362.5

DETAILS: 

Electroplated diamond is widely used for cutting
Glass materials: such as various glass tubes, glass rods, K9 glass, quartz glass, glass steel, ordinary glass, precious stones, crystals, etc.
Ceramic materials: such as alumina, yttria, black ceramics, ceramic wall tiles, facing tiles, glass products, mosaics, ceramic pipes, etc.
Magnetic materials: magnetic cores, magnetic sheets, rare earth neodymium iron boron, permanent magnet ferrites, rubber magnets, etc.
Photoelectric materials: LED, LCD, MP3, etc.
Stone materials: marble, granite, concrete, asphalt, tiles, sandstone, mineral rock, jade, agate, etc.
Semi-conductor materials: silicon carbide, solar cells, integrated circuits, ingots cut round, wafer cutting, etc.

FAQ & PRECAUGIONS:
1. When installing the blade, make sure that the direction indicated on the blade is the same as that of the cutter. Uneven directions are easily caused.
2. Use a reasonable cutting depth, not exceeding the maximum cutting depth of the cutting blade.
3. Inspect the blade for any damage, serious deformation, and damage if it is severe.
4. When stored, it needs to be stored in a dry environment to avoid rusting of the substrate caused by the wet environment.

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